Failure Analysis

Presto Engineering offers a very wide range of failure analysis (FA) capabilities, for advanced CMOS, specialty semiconductor as well as electronics (specifically printed circuit boards).

Our FA specialists address design debug, reliability-induced failures, as well as field return and RMAs. They use a well-established level 1/2/3 analysis framework that ensures fast turn-around time and consistency of results. Our FA teams leverage our in-house test floor to duplicate or screen incoming failing samples.

Our reports strive to provide your internal or external customers with actionable results that include recommendations for corrective action plans.

Non-exhaustive list of our capabilities include:

  • Auger, Micro-Auger
  • Atomic Force Microscopy (AFM)
  • Cross-section (Mechanical, Ion, FIB, Dual-beam)
  • Decapsulation (inc. copper leads)
  • Deprocessing
  • Dual-Beam (FIB/SEM); TEM sample preparation
  • Ellipsometry
  • Focus Ion Beam (FIB)
  • Infra-Red Imaging
  • Laser-Voltage techniques (LVx)
  • Microprobing
  • Photo-Emission Microscopy (PEM, OBIRCH/TIVA)
  • Plasma Etching
  • Profilometry
  • Raman
  • Scanning Electron Microscopy (SEM)
  • Scanning Acoustic Microscopy (SAM, C-mode/C-SAM)
  • Secondary Ion Mass Spectrometry (SIMS, D-SIMS, ToF-SIMS)
  • Soft-Defect Localization (SDL)
  • Thermal Imaging
  • Time Domain Reflectometry (TDR)
  • Transmission Electron Microscopy (TEM)
  • X-Ray (2D, 3D)
  • X-Ray Photoelectron Spectroscopy (XPS)