Back-end

Presto Engineering is a packaging and test expert, especially serving semiconductor applications where back-end matters—both technically and economically.

Our package and test engineering practice is second to none, built from expertise garnered at top semiconductor firms. We leverage this knowledge into efficient and cost-effective back-end production operations.

We operate five complete test floors, including two in Asia where your production will be supervised on site by our resident engineers (both in Bangkok and in Kaohsiung). We deploy not only advanced automated test equipment (ATE) capacity, but also complete lines of wafer back-end processing (back lapping, back grinding/thinning and dicing).

Most of our floors are secured (EAL 5+/6 certified) and support root of trust personalization (at wafer probe or package/final test) with all levels of security. Our secured floors and cages are operated from our own, local IT systems, interconnected to a dedicated, secure network.

Our local partners provide packaging/assembly operations so we can process lots under the same roof, from probe test, to wafer back-end, assembly, final test, and finishing. Our back-end operations are integrated into our global supply chain B2B system, including MES integration and web-based WIP tracking--providing you with web-based access to all of the production-related reports you need.