Our turn-key offering spans all capabilities required to bring your new design to production and to serve your customers.
From a Wafer Fabrication standpoint, we collaborate with CMOS foundries and most specialty foundries providing SiGe, GaAs, InP, GaN and other processes needed for RF and advanced mixed-signal applications. We either facilitate your driving and procuring wafers or we include wafer procurement in our turn-key packages. Our experts track your work-in-progress (WIP) and support yield improvements and solutions to yield excrusions. Our portofilio includes finished-goods agreement including yield targets and fixed unit pricing.
When it comes to Assembly, we support your requirements from qualification to low volume to higher volume, either in-house or through local and Far-East partners. Leveraging our long experience in reliability and back-end operations, we manage the whole cycle from package engineering to quality monitoring.
We perform most of Test in-house using our floors in North America, Europe and Israel. We develop and manage test solutions (both hardware and software) and strive to provide you with the shortest test time achievable against coverage. We support probe, wafer-level testing as well as final test for digital, memory, mixed-signal and RF applications.
Once tested, we finish products (including tape-and-reel) and we ship to your customers.